世界の電子サーキットボードレベルアンダーフィル材料市場

QYResearchが発行した調査報告書(QYR8D03359)
◆英語タイトル:Global Electronic Circuit Board Level Underfill Material Industry Research Report, Growth Trends and Competitive Analysis 2018-2025
◆商品コード:QYR8D03359
◆発行会社(リサーチ会社):QYResearch
◆発行日:2018年11月(※2024年版があります。お問い合わせください。)
◆ページ数:114
◆レポート形式:英語 / PDF
◆納品方法:Eメール(受注後3営業日)
◆調査対象地域:グローバル
◆産業分野:材料・化学
◆販売価格オプション(消費税別)
Single User(1名様閲覧用)USD5,600 ⇒換算¥828,800見積依頼/購入/質問フォーム
Enterprise(同一法人内共有可)USD11,200 ⇒換算¥1,657,600見積依頼/購入/質問フォーム
販売価格オプションの説明はこちらでご利用ガイドはこちらでご確認いただけます。
※お支払金額は「換算金額(日本円)+消費税+配送料(Eメール納品は無料)」です。
※本体価格が¥30,000未満のレポートにつきましては、ハンドリングチャージ¥5,000が別途かかります。
※Eメールによる納品の場合、通常ご注文当日〜2日以内に納品致します。
※レポート納品後、納品日+5日以内に請求書を発行し、お客様宛に郵送いたしますので、請求書発行日より2ヶ月以内に銀行振込にて支払をお願いします。
※上記の日本語題名はH&Iグローバルリサーチが翻訳したものです。英語版原本には日本語表記はありません。
※為替レートは適宜修正・更新しております。リアルタイム更新ではありません。
※弊社H&Iグローバルリサーチ株式会社はQYResearch社の日本における正規代理店です。同社発行の市場リサーチレポート及びリサーチサービスに関するお問い合わせは弊社までお願い致します。QYResearch社の概要及び新刊レポートはこちらでご確認いただけます。

本調査レポートは、電子サーキットボードレベルアンダーフィル材料のグローバル市場について調査・分析し、種類別には、クオーツ/シリコン、アルミナベース、エポキシベース、ウレタンベース、アクリルベース、その他に、用途別には、CSP(チップスケールパッケージ)、BGA(ボールグリッドアレー)、フリップチップに区分してまとめました。調査対象企業は、Henkel、Namics Corporation、AI Technology、Protavic International、H.B.Fuller、ASE Industrial Holding, Co., Ltd.、Hitachi Chemical、Indium Corporation、Zymet、LORD Corporation等です。

・レポートの概要
・グローバル成長トレンド
・電子サーキットボードレベルアンダーフィル材料の世界市場規模
・電子サーキットボードレベルアンダーフィル材料の地域別市場規模
・グローバル産業動向
・企業別市場シェア
・企業別電子サーキットボードレベルアンダーフィル材料の価格動向
・電子サーキットボードレベルアンダーフィル材料の種類別市場規模(クオーツ/シリコン、アルミナベース、エポキシベース、ウレタンベース、アクリルベース、その他)
・電子サーキットボードレベルアンダーフィル材料の用途別市場規模(CSP(チップスケールパッケージ)、BGA(ボールグリッドアレー)、フリップチップ)
・電子サーキットボードレベルアンダーフィル材料の北米市場(アメリカ、カナダ、メキシコ)
・電子サーキットボードレベルアンダーフィル材料のヨーロッパ市場(ドイツ、フランス、イギリス、イタリア、ロシア)
・電子サーキットボードレベルアンダーフィル材料のアジア市場(日本、中国、韓国、インド、オーストラリア、インドネシア、タイ、マレーシア、フィリピン、ベトナム)
・電子サーキットボードレベルアンダーフィル材料の中南米市場(ブラジル等)
・電子サーキットボードレベルアンダーフィル材料の中東・アフリカ市場(GCC、エジプト、南アフリカ)
・主要企業情報(Henkel、Namics Corporation、AI Technology、Protavic International、H.B.Fuller、ASE Industrial Holding, Co., Ltd.、Hitachi Chemical、Indium Corporation、Zymet、LORD Corporation)
 -企業概要、事業概要、販売・売上・市場シェア、XXX製品概要、企業動向
・バリューチェーン及び販売チャネル分析
・電子サーキットボードレベルアンダーフィル材料の市場規模予測
・電子サーキットボードレベルアンダーフィル材料の種類別市場予測2018-2025(クオーツ/シリコン、アルミナベース、エポキシベース、ウレタンベース、アクリルベース、その他)
・電子サーキットボードレベルアンダーフィル材料の用途別市場予測2018-2025(CSP(チップスケールパッケージ)、BGA(ボールグリッドアレー)、フリップチップ)
・電子サーキットボードレベルアンダーフィル材料の北米市場予測2018-2025(アメリカ、カナダ、メキシコ)
・電子サーキットボードレベルアンダーフィル材料のヨーロッパ市場予測2018-2025(ドイツ、フランス、イギリス、イタリア、ロシア)
・電子サーキットボードレベルアンダーフィル材料のアジア市場予測2018-2025(日本、中国、韓国、インド、オーストラリア、インドネシア、タイ、マレーシア、フィリピン、ベトナム)
・電子サーキットボードレベルアンダーフィル材料の中南米市場予測2018-2025(ブラジル等)
・電子サーキットボードレベルアンダーフィル材料の中東・アフリカ市場予測2018-2025(GCC、エジプト、南アフリカ)
・調査結果及び結論
【レポートの概要】

The Electronic Circuit Board Level Underfill Material market was valued at Million US$ in 2017 and is projected to reach Million US$ by 2025, at a CAGR of during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for Electronic Circuit Board Level Underfill Material.
This study focuses on the production side and consumption side of Electronic Circuit Board Level Underfill Material, presents the global Electronic Circuit Board Level Underfill Material market size by manufacturers, regions, type and application, history breakdown data from 2013 to 2018, and forecast to 2025.
In terms of production side, this report researches the Electronic Circuit Board Level Underfill Material capacity, production, value, ex-factory price, growth rate, market share for major manufacturers, regions (or countries) and product type.
In terms of consumption side, this report focuses on the consumption of Electronic Circuit Board Level Underfill Material by regions and application. The key regions like North America, Europe, Asia-Pacific, Central & South America, Middle East and Africa etc.

This report includes the following manufacturers; we can also add the other companies as you want.
Henkel
Namics Corporation
AI Technology
Protavic International
H.B.Fuller
ASE Industrial Holding, Co., Ltd.
Hitachi Chemical
Indium Corporation
Zymet
LORD Corporation

Market Segment by Product Type
Quartz/Silicone
Alumina Based
Epoxy Based
Urethane Based
Acrylic Based
Others

Market Segment by Application
CSP(Chip Scale Package)
BGA(Ball Grid Array)
Flip Chips

Key Regions split in this report:
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Central & South America
Brazil
Rest of Central & South America
Middle East & Africa

The study objectives are:
To analyze and research the global Electronic Circuit Board Level Underfill Material status and future forecast, involving capacity, production, value, consumption, growth rate (CAGR), market share, historical and forecast.
To present the key Electronic Circuit Board Level Underfill Material manufacturers, capacity, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

In this study, the years considered to estimate the market size of Electronic Circuit Board Level Underfill Material are as follows:
History Year: 2013-2018
Base Year: 2017
Estimated Year: 2018
Forecast Year 2018 to 2025

【レポートの目次】

Table of Contents

1 Report Overview
1.1 Research Scope
1.2 Major Manufacturers Covered in This Report
1.3 Market Segment by Type
1.3.1 Global Electronic Circuit Board Level Underfill Material Market Size Growth Rate by Type
1.3.2 Quartz/Silicone
1.3.3 Alumina Based
1.3.4 Epoxy Based
1.3.5 Urethane Based
1.3.6 Acrylic Based
1.3.7 Others
1.4 Market Segment by Application
1.4.1 Global Electronic Circuit Board Level Underfill Material Market Share by Application (2018-2025)
1.4.2 CSP(Chip Scale Package)
1.4.3 BGA(Ball Grid Array)
1.4.4 Flip Chips
1.5 Study Objectives
1.6 Years Considered

2 Global Growth Trends
2.1 Production and Capacity Analysis
2.1.1 Global Electronic Circuit Board Level Underfill Material Production Value 2013-2025
2.1.2 Global Electronic Circuit Board Level Underfill Material Production 2013-2025
2.1.3 Global Electronic Circuit Board Level Underfill Material Capacity 2013-2025
2.1.4 Global Electronic Circuit Board Level Underfill Material Marketing Pricing and Trends
2.2 Key Producers Growth Rate (CAGR) 2018-2025
2.2.1 Global Electronic Circuit Board Level Underfill Material Market Size CAGR of Key Regions
2.2.2 Global Electronic Circuit Board Level Underfill Material Market Share of Key Regions
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Drivers

3 Market Share by Manufacturers
3.1 Capacity and Production by Manufacturers
3.1.1 Global Electronic Circuit Board Level Underfill Material Capacity by Manufacturers
3.1.2 Global Electronic Circuit Board Level Underfill Material Production by Manufacturers
3.2 Revenue by Manufacturers
3.2.1 Electronic Circuit Board Level Underfill Material Revenue by Manufacturers (2013-2018)
3.2.2 Electronic Circuit Board Level Underfill Material Revenue Share by Manufacturers (2013-2018)
3.2.3 Global Electronic Circuit Board Level Underfill Material Market Concentration Ratio (CR5 and HHI)
3.3 Electronic Circuit Board Level Underfill Material Price by Manufacturers
3.4 Key Manufacturers Electronic Circuit Board Level Underfill Material Plants/Factories Distribution and Area Served
3.5 Date of Key Manufacturers Enter into Electronic Circuit Board Level Underfill Material Market
3.6 Key Manufacturers Electronic Circuit Board Level Underfill Material Product Offered
3.7 Mergers & Acquisitions, Expansion Plans

4 Market Size by Type
4.1 Production and Production Value for Each Type
4.1.1 Quartz/Silicone Production and Production Value (2013-2018)
4.1.2 Alumina Based Production and Production Value (2013-2018)
4.1.3 Epoxy Based Production and Production Value (2013-2018)
4.1.4 Urethane Based Production and Production Value (2013-2018)
4.1.5 Acrylic Based Production and Production Value (2013-2018)
4.1.6 Others Production and Production Value (2013-2018)
4.2 Global Electronic Circuit Board Level Underfill Material Production Market Share by Type
4.3 Global Electronic Circuit Board Level Underfill Material Production Value Market Share by Type
4.4 Electronic Circuit Board Level Underfill Material Ex-factory Price by Type

5 Market Size by Application
5.1 Overview
5.2 Global Electronic Circuit Board Level Underfill Material Consumption by Application

6 Production by Regions
6.1 Global Electronic Circuit Board Level Underfill Material Production (History Data) by Regions 2013-2018
6.2 Global Electronic Circuit Board Level Underfill Material Production Value (History Data) by Regions
6.3 United States
6.3.1 United States Electronic Circuit Board Level Underfill Material Production Growth Rate 2013-2018
6.3.2 United States Electronic Circuit Board Level Underfill Material Production Value Growth Rate 2013-2018
6.3.3 Key Players in United States
6.3.4 United States Electronic Circuit Board Level Underfill Material Import & Export
6.4 Europe
6.4.1 Europe Electronic Circuit Board Level Underfill Material Production Growth Rate 2013-2018
6.4.2 Europe Electronic Circuit Board Level Underfill Material Production Value Growth Rate 2013-2018
6.4.3 Key Players in Europe
6.4.4 Europe Electronic Circuit Board Level Underfill Material Import & Export
6.5 China
6.5.3 Key Players in China
6.5.2 China Electronic Circuit Board Level Underfill Material Production Value Growth Rate 2013-2018
6.5.3 Key Players in China
6.5.4 China Electronic Circuit Board Level Underfill Material Import & Export
6.6 Japan
6.6.1 Japan Electronic Circuit Board Level Underfill Material Production Growth Rate 2013-2018
6.6.2 Japan Electronic Circuit Board Level Underfill Material Production Value Growth Rate 2013-2018
6.6.3 Key Players in Japan
6.6.4 Japan Electronic Circuit Board Level Underfill Material Import & Export
6.7 Other Regions
6.7.1 South Korea
6.7.2 India
6.7.3 Southeast Asia

7 Electronic Circuit Board Level Underfill Material Consumption by Regions
7.1 Global Electronic Circuit Board Level Underfill Material Consumption (History Data) by Regions
7.2 North America
7.2.1 North America Electronic Circuit Board Level Underfill Material Consumption by Type
7.2.2 North America Electronic Circuit Board Level Underfill Material Consumption by Application
7.2.3 North America Electronic Circuit Board Level Underfill Material Consumption by Countries
7.2.4 United States
7.2.5 Canada
7.2.6 Mexico
7.3 Europe
7.3.1 Europe Electronic Circuit Board Level Underfill Material Consumption by Type
7.3.2 Europe Electronic Circuit Board Level Underfill Material Consumption by Application
7.3.3 Europe Electronic Circuit Board Level Underfill Material Consumption by Countries
7.3.4 Germany
7.3.5 France
7.3.6 UK
7.3.7 Italy
7.3.8 Russia
7.4 Asia Pacific
7.4.1 Asia Pacific Electronic Circuit Board Level Underfill Material Consumption by Type
7.4.2 Asia Pacific Electronic Circuit Board Level Underfill Material Consumption by Application
7.4.3 Asia Pacific Electronic Circuit Board Level Underfill Material Consumption by Countries
7.4.4 China
7.4.5 Japan
7.4.6 Korea
7.4.7 India
7.4.8 Australia
7.4.9 Indonesia
7.4.10 Thailand
7.4.11 Malaysia
7.4.12 Philippines
7.4.13 Vietnam
7.5 Central & South America
7.5.1 Central & South America Electronic Circuit Board Level Underfill Material Consumption by Type
7.5.2 Central & South America Electronic Circuit Board Level Underfill Material Consumption by Application
7.5.3 Central & South America Electronic Circuit Board Level Underfill Material Consumption by Countries
7.5.4 Brazil
7.6 Middle East and Africa
7.6.1 Middle East and Africa Electronic Circuit Board Level Underfill Material Consumption by Type
7.6.2 Middle East and Africa Electronic Circuit Board Level Underfill Material Consumption by Application

8 Company Profiles
8.1 Henkel
8.1.1 Henkel Company Details
8.1.2 Company Description and Business Overview
8.1.3 Production and Revenue of Electronic Circuit Board Level Underfill Material
8.1.4 Electronic Circuit Board Level Underfill Material Product Introduction
8.1.5 Henkel Recent Development
8.2 Namics Corporation
8.2.1 Namics Corporation Company Details
8.2.2 Company Description and Business Overview
8.2.3 Production and Revenue of Electronic Circuit Board Level Underfill Material
8.2.4 Electronic Circuit Board Level Underfill Material Product Introduction
8.2.5 Namics Corporation Recent Development
8.3 AI Technology
8.3.1 AI Technology Company Details
8.3.2 Company Description and Business Overview
8.3.3 Production and Revenue of Electronic Circuit Board Level Underfill Material
8.3.4 Electronic Circuit Board Level Underfill Material Product Introduction
8.3.5 AI Technology Recent Development
8.4 Protavic International
8.4.1 Protavic International Company Details
8.4.2 Company Description and Business Overview
8.4.3 Production and Revenue of Electronic Circuit Board Level Underfill Material
8.4.4 Electronic Circuit Board Level Underfill Material Product Introduction
8.4.5 Protavic International Recent Development
8.5 H.B.Fuller
8.5.1 H.B.Fuller Company Details
8.5.2 Company Description and Business Overview
8.5.3 Production and Revenue of Electronic Circuit Board Level Underfill Material
8.5.4 Electronic Circuit Board Level Underfill Material Product Introduction
8.5.5 H.B.Fuller Recent Development
8.6 ASE Industrial Holding, Co., Ltd.
8.6.1 ASE Industrial Holding, Co., Ltd. Company Details
8.6.2 Company Description and Business Overview
8.6.3 Production and Revenue of Electronic Circuit Board Level Underfill Material
8.6.4 Electronic Circuit Board Level Underfill Material Product Introduction
8.6.5 ASE Industrial Holding, Co., Ltd. Recent Development
8.7 Hitachi Chemical
8.7.1 Hitachi Chemical Company Details
8.7.2 Company Description and Business Overview
8.7.3 Production and Revenue of Electronic Circuit Board Level Underfill Material
8.7.4 Electronic Circuit Board Level Underfill Material Product Introduction
8.7.5 Hitachi Chemical Recent Development
8.8 Indium Corporation
8.8.1 Indium Corporation Company Details
8.8.2 Company Description and Business Overview
8.8.3 Production and Revenue of Electronic Circuit Board Level Underfill Material
8.8.4 Electronic Circuit Board Level Underfill Material Product Introduction
8.8.5 Indium Corporation Recent Development
8.9 Zymet
8.9.1 Zymet Company Details
8.9.2 Company Description and Business Overview
8.9.3 Production and Revenue of Electronic Circuit Board Level Underfill Material
8.9.4 Electronic Circuit Board Level Underfill Material Product Introduction
8.9.5 Zymet Recent Development
8.10 LORD Corporation
8.10.1 LORD Corporation Company Details
8.10.2 Company Description and Business Overview
8.10.3 Production and Revenue of Electronic Circuit Board Level Underfill Material
8.10.4 Electronic Circuit Board Level Underfill Material Product Introduction
8.10.5 LORD Corporation Recent Development

9 Market Forecast: Production Side
9.1 Production and Production Value Forecast
9.1.1 Global Electronic Circuit Board Level Underfill Material Capacity, Production Forecast 2018-2025
9.1.2 Global Electronic Circuit Board Level Underfill Material Production Value Forecast 2018-2025
9.2 Electronic Circuit Board Level Underfill Material Production and Production Value Forecast by Regions
9.2.1 Global Electronic Circuit Board Level Underfill Material Production Value Forecast by Regions
9.2.2 Global Electronic Circuit Board Level Underfill Material Production Forecast by Regions
9.3 Electronic Circuit Board Level Underfill Material Key Producers Forecast
9.3.1 United States
9.3.2 Europe
9.3.3 China
9.3.4 Japan
9.3.5 Other Regions
9.4 Forecast by Type
9.4.1 Global Electronic Circuit Board Level Underfill Material Production Forecast by Type
9.4.2 Global Electronic Circuit Board Level Underfill Material Production Value Forecast by Type

10 Market Forecast: Consumption Side
10.1 Consumption Forecast by Application
10.2 Electronic Circuit Board Level Underfill Material Consumption Forecast by Regions
10.3 North America Market Consumption Forecast
10.3.1 North America Electronic Circuit Board Level Underfill Material Consumption Forecast by Countries 2018-2025
10.3.2 United States
10.3.3 Canada
10.3.4 Mexico
10.4 Europe Market Consumption Forecast
10.4.1 Europe Electronic Circuit Board Level Underfill Material Consumption Forecast by Countries 2018-2025
10.4.2 Germany
10.4.3 France
10.4.4 UK
10.4.5 Italy
10.4.6 Russia
10.5 Asia Pacific Market Consumption Forecast
10.5.1 Asia Pacific Electronic Circuit Board Level Underfill Material Consumption Forecast by Countries 2018-2025
10.5.2 China
10.5.3 Japan
10.5.4 Korea
10.5.5 India
10.5.6 Australia
10.5.7 Indonesia
10.5.8 Thailand
10.5.9 Malaysia
10.5.10 Philippines
10.5.11 Vietnam
10.6 Central & South America Market Consumption Forecast
10.6.1 Central & South America Electronic Circuit Board Level Underfill Material Consumption Forecast by Country 2018-2025
10.6.2 Brazil
10.7 Middle East and Africa Market Consumption Forecast
10.7.1 Middle East and Africa Electronic Circuit Board Level Underfill Material Consumption Forecast by Countries 2018-2025
10.7.2 Middle East and Africa
10.7.3 GCC Countries
10.7.4 Egypt
10.7.5 South Africa

11 Value Chain and Sales Channels Analysis
11.1 Value Chain Analysis
11.2 Sales Channels Analysis
11.2.1 Electronic Circuit Board Level Underfill Material Sales Channels
11.2.2 Electronic Circuit Board Level Underfill Material Distributors
11.3 Electronic Circuit Board Level Underfill Material Customers

12 Opportunities & Challenges, Threat and Affecting Factors
12.1 Market Opportunities
12.2 Market Challenges
12.3 Porter’s Five Forces Analysis
12.4 Macroscopic Indicator
12.4.1 GDP for Major Regions
12.4.2 Price of Raw Materials in Dollars: Evolution

13 Key Findings

14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.1.1 Research Programs/Design
14.1.1.2 Market Size Estimation
14.1.1.3 Market Breakdown and Data Triangulation
14.1.2 Data Source
14.1.2.1 Secondary Sources
14.1.2.2 Primary Sources
14.2 Author Details
14.3 Disclaimer

...

【掲載企業】

Henkel、Namics Corporation、AI Technology、Protavic International、H.B.Fuller、ASE Industrial Holding, Co., Ltd.、Hitachi Chemical、Indium Corporation、Zymet、LORD Corporation

【免責事項】
https://www.globalresearch.jp/disclaimer

★リサーチレポート[ 世界の電子サーキットボードレベルアンダーフィル材料市場(Global Electronic Circuit Board Level Underfill Material Industry Research Report, Growth Trends and Competitive Analysis 2018-2025)]についてメールでお問い合わせはこちらでお願いします。