世界の半導体パッケージング・アセンブリ装置市場2020年:企業別・地域別・種類別・用途別市場予測(~2025年)

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本調査レポートでは、半導体パッケージング・アセンブリ装置の世界市場を広く調査・分析し、今後の市場展望をまとめております。半導体パッケージング・アセンブリ装置の種類別市場規模(ダイレベル包装・アセンブリ機器、ウエハレベル包装・アセンブリ機器)、用途別市場規模(IDM(統合型デバイスメーカー)、OSAT(パッケージングからテストまで請け負う製造業者))、地域別市場規模(北米、アメリカ、ヨーロッパ、アジア、中国、日本、東南アジア、南米、中東、アフリカなど)、市場動向、メーカー別販売量と市場シェア、販売チャネルなどの情報を掲載しています。
・市場概要
・メーカー情報(販売量、市場シェア、製品概要、SWOT分析):Applied Materials、Rudolph Technologies、EV Group、ASMPT、Tokyo Seimitsu、DISCO Corporation、Suss Microtec、TEL、Kulicke and Soffa Industries、SEMES、Veeco/CNT、Ulvac Technologies、
・地域別グローバル市場分析 2015年-2020年
・半導体パッケージング・アセンブリ装置の北米市場(アメリカ、カナダ、メキシコ)
・半導体パッケージング・アセンブリ装置のヨーロッパ市場(ドイツ、イギリス、フランス、ロシア、イタリア)
・半導体パッケージング・アセンブリ装置のアジア市場(中国、日本、韓国、インド、東南アジア、オーストラリア)
・半導体パッケージング・アセンブリ装置の南米市場(ブラジル、アルゼンチン)
・半導体パッケージング・アセンブリ装置の中東・アフリカ市場(サウジアラビア、トルコ、エジプト、南アフリカ)
・種類別分析:ダイレベル包装・アセンブリ機器、ウエハレベル包装・アセンブリ機器
・用途別分析:IDM(統合型デバイスメーカー)、OSAT(パッケージングからテストまで請け負う製造業者)
・地域別市場規模予測 2021年-2025年
・販売チャネル、流通業者、代理店
・調査の結果・結論
【レポートの概要】

Market Overview
The global Semiconductor Packaging and Assembly Equipment market size is expected to gain market growth in the forecast period of 2020 to 2025, with a CAGR of 5.6% in the forecast period of 2020 to 2025 and will expected to reach USD 3417.7 million by 2025, from USD 2749.6 million in 2019.

The Semiconductor Packaging and Assembly Equipment market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.

Market segmentation
Semiconductor Packaging and Assembly Equipment market is split by Type and by Application. For the period 2015-2025, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

By Type, Semiconductor Packaging and Assembly Equipment market has been segmented into
Die- Level Packaging and Assembly Equipment
Wafer-Level Packaging and Assembly Equipment

By Application, Semiconductor Packaging and Assembly Equipment has been segmented into:
IDM (Integrated Device Manufacturers)
OSAT (Outsourced Semiconductor Assembly and Test Companies)

Regions and Countries Level Analysis
Regional analysis is another highly comprehensive part of the research and analysis study of the global Semiconductor Packaging and Assembly Equipment market presented in the report. This section sheds light on the sales growth of different regional and country-level Semiconductor Packaging and Assembly Equipment markets. For the historical and forecast period 2015 to 2025, it provides detailed and accurate country-wise volume analysis and region-wise market size analysis of the global Semiconductor Packaging and Assembly Equipment market.

The report offers in-depth assessment of the growth and other aspects of the Semiconductor Packaging and Assembly Equipment market in important countries (regions), including:
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, etc.)
Middle East & Africa (Saudi Arabia, Egypt, Nigeria and South Africa)

Competitive Landscape and Semiconductor Packaging and Assembly Equipment Market Share Analysis
Semiconductor Packaging and Assembly Equipment competitive landscape provides details by vendors, including company overview, company total revenue (financials), market potential, global presence, Semiconductor Packaging and Assembly Equipment sales and revenue generated, market share, price, production sites and facilities, SWOT analysis, product launch. For the period 2015-2020, this study provides the Semiconductor Packaging and Assembly Equipment sales, revenue and market share for each player covered in this report.

The major players covered in Semiconductor Packaging and Assembly Equipment are:
Applied Materials
Rudolph Technologies
EV Group
ASMPT
Tokyo Seimitsu
DISCO Corporation
Suss Microtec
TEL
Kulicke and Soffa Industries
SEMES
Veeco/CNT
Ulvac Technologies

Among other players domestic and global, Semiconductor Packaging and Assembly Equipment market share data is available for global, North America, Europe, Asia-Pacific, Middle East and Africa and South America separately. Global Info Research analysts understand competitive strengths and provide competitive analysis for each competitor separately.

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor Packaging and Assembly Equipment product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Semiconductor Packaging and Assembly Equipment, with price, sales, revenue and global market share of Semiconductor Packaging and Assembly Equipment in 2018 and 2019.
Chapter 3, the Semiconductor Packaging and Assembly Equipment competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor Packaging and Assembly Equipment breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2015 to 2020.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2015 to 2020.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2015 to 2020.
Chapter 12, Semiconductor Packaging and Assembly Equipment market forecast, by regions, type and application, with sales and revenue, from 2020 to 2025.
Chapter 13, 14 and 15, to describe Semiconductor Packaging and Assembly Equipment sales channel, distributors, customers, research findings and conclusion, appendix and data source.

【レポートの目次】

Table of Contents

1 Market Overview
1.1 Semiconductor Packaging and Assembly Equipment Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Semiconductor Packaging and Assembly Equipment Revenue by Type: 2015 VS 2019 VS 2025
1.2.2 Die- Level Packaging and Assembly Equipment
1.2.3 Wafer-Level Packaging and Assembly Equipment
1.3 Market Analysis by Application
1.3.1 Overview: Global Semiconductor Packaging and Assembly Equipment Revenue by Application: 2015 VS 2019 VS 2025
1.3.2 IDM (Integrated Device Manufacturers)
1.3.3 OSAT (Outsourced Semiconductor Assembly and Test Companies)
1.4 Overview of Global Semiconductor Packaging and Assembly Equipment Market
1.4.1 Global Semiconductor Packaging and Assembly Equipment Market Status and Outlook (2015-2025)
1.4.2 North America (United States, Canada and Mexico)
1.4.3 Europe (Germany, France, United Kingdom, Russia and Italy)
1.4.4 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
1.4.5 South America, Middle East & Africa
1.5 Market Dynamics
1.5.1 Market Opportunities
1.5.2 Market Risk
1.5.3 Market Driving Force
2 Manufacturers Profiles
2.1 Applied Materials
2.1.1 Applied Materials Details
2.1.2 Applied Materials Major Business and Total Revenue (Financial Highlights) Analysis
2.1.3 Applied Materials SWOT Analysis
2.1.4 Applied Materials Product and Services
2.1.5 Applied Materials Semiconductor Packaging and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.2 Rudolph Technologies
2.2.1 Rudolph Technologies Details
2.2.2 Rudolph Technologies Major Business and Total Revenue (Financial Highlights) Analysis
2.2.3 Rudolph Technologies SWOT Analysis
2.2.4 Rudolph Technologies Product and Services
2.2.5 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.3 EV Group
2.3.1 EV Group Details
2.3.2 EV Group Major Business and Total Revenue (Financial Highlights) Analysis
2.3.3 EV Group SWOT Analysis
2.3.4 EV Group Product and Services
2.3.5 EV Group Semiconductor Packaging and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.4 ASMPT
2.4.1 ASMPT Details
2.4.2 ASMPT Major Business and Total Revenue (Financial Highlights) Analysis
2.4.3 ASMPT SWOT Analysis
2.4.4 ASMPT Product and Services
2.4.5 ASMPT Semiconductor Packaging and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.5 Tokyo Seimitsu
2.5.1 Tokyo Seimitsu Details
2.5.2 Tokyo Seimitsu Major Business and Total Revenue (Financial Highlights) Analysis
2.5.3 Tokyo Seimitsu SWOT Analysis
2.5.4 Tokyo Seimitsu Product and Services
2.5.5 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.6 DISCO Corporation
2.6.1 DISCO Corporation Details
2.6.2 DISCO Corporation Major Business and Total Revenue (Financial Highlights) Analysis
2.6.3 DISCO Corporation SWOT Analysis
2.6.4 DISCO Corporation Product and Services
2.6.5 DISCO Corporation Semiconductor Packaging and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.7 Suss Microtec
2.7.1 Suss Microtec Details
2.7.2 Suss Microtec Major Business and Total Revenue (Financial Highlights) Analysis
2.7.3 Suss Microtec SWOT Analysis
2.7.4 Suss Microtec Product and Services
2.7.5 Suss Microtec Semiconductor Packaging and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.8 TEL
2.8.1 TEL Details
2.8.2 TEL Major Business and Total Revenue (Financial Highlights) Analysis
2.8.3 TEL SWOT Analysis
2.8.4 TEL Product and Services
2.8.5 TEL Semiconductor Packaging and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.9 Kulicke and Soffa Industries
2.9.1 Kulicke and Soffa Industries Details
2.9.2 Kulicke and Soffa Industries Major Business and Total Revenue (Financial Highlights) Analysis
2.9.3 Kulicke and Soffa Industries SWOT Analysis
2.9.4 Kulicke and Soffa Industries Product and Services
2.9.5 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.10 SEMES
2.10.1 SEMES Details
2.10.2 SEMES Major Business and Total Revenue (Financial Highlights) Analysis
2.10.3 SEMES SWOT Analysis
2.10.4 SEMES Product and Services
2.10.5 SEMES Semiconductor Packaging and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.11 Veeco/CNT
2.11.1 Veeco/CNT Details
2.11.2 Veeco/CNT Major Business and Total Revenue (Financial Highlights) Analysis
2.11.3 Veeco/CNT SWOT Analysis
2.11.4 Veeco/CNT Product and Services
2.11.5 Veeco/CNT Semiconductor Packaging and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.12 Ulvac Technologies
2.12.1 Ulvac Technologies Details
2.12.2 Ulvac Technologies Major Business and Total Revenue (Financial Highlights) Analysis
2.12.3 Ulvac Technologies SWOT Analysis
2.12.4 Ulvac Technologies Product and Services
2.12.5 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
3 Sales, Revenue and Market Share by Manufacturer
3.1 Global Semiconductor Packaging and Assembly Equipment Sales and Market Share by Manufacturer (2018-2019)
3.2 Global Semiconductor Packaging and Assembly Equipment Revenue and Market Share by Manufacturer (2018-2019)
3.3 Market Concentration Rate
3.3.1 Top 3 Semiconductor Packaging and Assembly Equipment Manufacturer Market Share in 2019
3.3.2 Top 6 Semiconductor Packaging and Assembly Equipment Manufacturer Market Share in 2019
3.4 Market Competition Trend
4 Global Market Analysis by Regions
4.1 Global Semiconductor Packaging and Assembly Equipment Sales, Revenue and Market Share by Regions
4.1.1 Global Semiconductor Packaging and Assembly Equipment Sales and Market Share by Regions (2015-2020)
4.1.2 Global Semiconductor Packaging and Assembly Equipment Revenue and Market Share by Regions (2015-2020)
4.2 North America Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
4.3 Europe Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
4.4 Asia-Pacific Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
4.5 South America Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
4.6 Middle East and Africa Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
5 North America by Country
5.1 North America Semiconductor Packaging and Assembly Equipment Sales, Revenue and Market Share by Country
5.1.1 North America Semiconductor Packaging and Assembly Equipment Sales and Market Share by Country (2015-2020)
5.1.2 North America Semiconductor Packaging and Assembly Equipment Revenue and Market Share by Country (2015-2020)
5.2 United States Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
5.3 Canada Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
5.4 Mexico Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
6 Europe by Country
6.1 Europe Semiconductor Packaging and Assembly Equipment Sales, Revenue and Market Share by Country
6.1.1 Europe Semiconductor Packaging and Assembly Equipment Sales and Market Share by Country (2015-2020)
6.1.2 Europe Semiconductor Packaging and Assembly Equipment Revenue and Market Share by Country (2015-2020)
6.2 Germany Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
6.3 UK Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
6.4 France Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
6.5 Russia Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
6.6 Italy Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
7 Asia-Pacific by Regions
7.1 Asia-Pacific Semiconductor Packaging and Assembly Equipment Sales, Revenue and Market Share by Regions
7.1.1 Asia-Pacific Semiconductor Packaging and Assembly Equipment Sales and Market Share by Regions (2015-2020)
7.1.2 Asia-Pacific Semiconductor Packaging and Assembly Equipment Revenue and Market Share by Regions (2015-2020)
7.2 China Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
7.3 Japan Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
7.4 Korea Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
7.5 India Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
7.6 Southeast Asia Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
7.7 Australia Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
8 South America by Country
8.1 South America Semiconductor Packaging and Assembly Equipment Sales, Revenue and Market Share by Country
8.1.1 South America Semiconductor Packaging and Assembly Equipment Sales and Market Share by Country (2015-2020)
8.1.2 South America Semiconductor Packaging and Assembly Equipment Revenue and Market Share by Country (2015-2020)
8.2 Brazil Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
8.3 Argentina Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
9 Middle East & Africa by Countries
9.1 Middle East & Africa Semiconductor Packaging and Assembly Equipment Sales, Revenue and Market Share by Country
9.1.1 Middle East & Africa Semiconductor Packaging and Assembly Equipment Sales and Market Share by Country (2015-2020)
9.1.2 Middle East & Africa Semiconductor Packaging and Assembly Equipment Revenue and Market Share by Country (2015-2020)
9.2 Saudi Arabia Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
9.3 Turkey Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
9.4 Egypt Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
9.5 South Africa Semiconductor Packaging and Assembly Equipment Sales and Growth Rate (2015-2020)
10 Market Segment by Type
10.1 Global Semiconductor Packaging and Assembly Equipment Sales and Market Share by Type (2015-2020)
10.2 Global Semiconductor Packaging and Assembly Equipment Revenue and Market Share by Type (2015-2020)
10.3 Global Semiconductor Packaging and Assembly Equipment Price by Type (2015-2020)
11 Global Semiconductor Packaging and Assembly Equipment Market Segment by Application
11.1 Global Semiconductor Packaging and Assembly Equipment Sales Market Share by Application (2015-2020)
11.2 Global Semiconductor Packaging and Assembly Equipment Revenue Market Share by Application (2015-2020)
11.3 Global Semiconductor Packaging and Assembly Equipment Price by Application (2015-2020)
12 Market Forecast
12.1 Global Semiconductor Packaging and Assembly Equipment Sales, Revenue and Growth Rate (2021-2025)
12.2 Semiconductor Packaging and Assembly Equipment Market Forecast by Regions (2021-2025)
12.2.1 North America Semiconductor Packaging and Assembly Equipment Market Forecast (2021-2025)
12.2.2 Europe Semiconductor Packaging and Assembly Equipment Market Forecast (2021-2025)
12.2.3 Asia-Pacific Semiconductor Packaging and Assembly Equipment Market Forecast (2021-2025)
12.2.4 South America Semiconductor Packaging and Assembly Equipment Market Forecast (2021-2025)
12.2.5 Middle East & Africa Semiconductor Packaging and Assembly Equipment Market Forecast (2021-2025)
12.3 Semiconductor Packaging and Assembly Equipment Market Forecast by Type (2021-2025)
12.3.1 Global Semiconductor Packaging and Assembly Equipment Sales Forecast by Type (2021-2025)
12.3.2 Global Semiconductor Packaging and Assembly Equipment Market Share Forecast by Type (2021-2025)
12.4 Semiconductor Packaging and Assembly Equipment Market Forecast by Application (2021-2025)
12.4.1 Global Semiconductor Packaging and Assembly Equipment Sales Forecast by Application (2021-2025)
12.4.2 Global Semiconductor Packaging and Assembly Equipment Market Share Forecast by Application (2021-2025)
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 Distributors, Traders and Dealers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Data Source
15.3 Disclaimer
15.4 About US

...

【掲載企業】

Applied Materials、Rudolph Technologies、EV Group、ASMPT、Tokyo Seimitsu、DISCO Corporation、Suss Microtec、TEL、Kulicke and Soffa Industries、SEMES、Veeco/CNT、Ulvac Technologies、

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