世界の半導体ウエハ研削装置市場2020年:企業別・地域別・種類別・用途別市場予測(~2025年)

GlobalInfoResearchが発行した調査報告書(GIR20DC8385)
◆英語タイトル:Global Semiconductor Wafer Grinding Equipment Market 2020 by Manufacturers, Regions, Type and Application, Forecast to 2025
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◆発行日:2020年12月(※2024年版があります。お問い合わせください。)
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本調査レポートでは、半導体ウエハ研削装置の世界市場を広く調査・分析し、今後の市場展望をまとめております。半導体ウエハ研削装置の種類別市場規模(円筒研削、表面研削、その他)、用途別市場規模(ファウンドリ、メモリ製造業者、IDM)、地域別市場規模(北米、アメリカ、ヨーロッパ、アジア、中国、日本、東南アジア、南米、中東、アフリカなど)、市場動向、メーカー別販売量と市場シェア、販売チャネルなどの情報を掲載しています。
・市場概要
・メーカー情報(販売量、市場シェア、製品概要、SWOT分析):Applied Materials、Logomatic、Logitech、Ebara Corporation、Tokyo Seimitsu、Lapmaster、Revasum、Entrepix、
・地域別グローバル市場分析 2015年-2020年
・半導体ウエハ研削装置の北米市場(アメリカ、カナダ、メキシコ)
・半導体ウエハ研削装置のヨーロッパ市場(ドイツ、イギリス、フランス、ロシア、イタリア)
・半導体ウエハ研削装置のアジア市場(中国、日本、韓国、インド、東南アジア、オーストラリア)
・半導体ウエハ研削装置の南米市場(ブラジル、アルゼンチン)
・半導体ウエハ研削装置の中東・アフリカ市場(サウジアラビア、トルコ、エジプト、南アフリカ)
・種類別分析:円筒研削、表面研削、その他
・用途別分析:ファウンドリ、メモリ製造業者、IDM
・地域別市場規模予測 2021年-2025年
・販売チャネル、流通業者、代理店
・調査の結果・結論
【レポートの概要】

Market Overview
The global Semiconductor Wafer Grinding Equipment market size is expected to gain market growth in the forecast period of 2020 to 2025, with a CAGR of xx% in the forecast period of 2020 to 2025 and will expected to reach USD xx million by 2025, from USD xx million in 2019.

The Semiconductor Wafer Grinding Equipment market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.

Market segmentation
Semiconductor Wafer Grinding Equipment market is split by Type and by Application. For the period 2015-2025, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

By Type, Semiconductor Wafer Grinding Equipment market has been segmented into
Cylindrical Grinding
Surface Grinding
Other

By Application, Semiconductor Wafer Grinding Equipment has been segmented into:
Foundries
Memory Manufacturers
IDMs

Regions and Countries Level Analysis
Regional analysis is another highly comprehensive part of the research and analysis study of the global Semiconductor Wafer Grinding Equipment market presented in the report. This section sheds light on the sales growth of different regional and country-level Semiconductor Wafer Grinding Equipment markets. For the historical and forecast period 2015 to 2025, it provides detailed and accurate country-wise volume analysis and region-wise market size analysis of the global Semiconductor Wafer Grinding Equipment market.

The report offers in-depth assessment of the growth and other aspects of the Semiconductor Wafer Grinding Equipment market in important countries (regions), including:
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, etc.)
Middle East & Africa (Saudi Arabia, Egypt, Nigeria and South Africa)

Competitive Landscape and Semiconductor Wafer Grinding Equipment Market Share Analysis
Semiconductor Wafer Grinding Equipment competitive landscape provides details by vendors, including company overview, company total revenue (financials), market potential, global presence, Semiconductor Wafer Grinding Equipment sales and revenue generated, market share, price, production sites and facilities, SWOT analysis, product launch. For the period 2015-2020, this study provides the Semiconductor Wafer Grinding Equipment sales, revenue and market share for each player covered in this report.

The major players covered in Semiconductor Wafer Grinding Equipment are:
Applied Materials
Logomatic
Logitech
Ebara Corporation
Tokyo Seimitsu
Lapmaster
Revasum
Entrepix

Among other players domestic and global, Semiconductor Wafer Grinding Equipment market share data is available for global, North America, Europe, Asia-Pacific, Middle East and Africa and South America separately. Global Info Research analysts understand competitive strengths and provide competitive analysis for each competitor separately.

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor Wafer Grinding Equipment product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Semiconductor Wafer Grinding Equipment, with price, sales, revenue and global market share of Semiconductor Wafer Grinding Equipment in 2018 and 2019.
Chapter 3, the Semiconductor Wafer Grinding Equipment competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor Wafer Grinding Equipment breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2015 to 2020.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2015 to 2020.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2015 to 2020.
Chapter 12, Semiconductor Wafer Grinding Equipment market forecast, by regions, type and application, with sales and revenue, from 2020 to 2025.
Chapter 13, 14 and 15, to describe Semiconductor Wafer Grinding Equipment sales channel, distributors, customers, research findings and conclusion, appendix and data source.

【レポートの目次】

Table of Contents

1 Market Overview
1.1 Semiconductor Wafer Grinding Equipment Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Semiconductor Wafer Grinding Equipment Revenue by Type: 2015 VS 2019 VS 2025
1.2.2 Cylindrical Grinding
1.2.3 Surface Grinding
1.2.4 Other
1.3 Market Analysis by Application
1.3.1 Overview: Global Semiconductor Wafer Grinding Equipment Revenue by Application: 2015 VS 2019 VS 2025
1.3.2 Foundries
1.3.3 Memory Manufacturers
1.3.4 IDMs
1.4 Overview of Global Semiconductor Wafer Grinding Equipment Market
1.4.1 Global Semiconductor Wafer Grinding Equipment Market Status and Outlook (2015-2025)
1.4.2 North America (United States, Canada and Mexico)
1.4.3 Europe (Germany, France, United Kingdom, Russia and Italy)
1.4.4 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
1.4.5 South America, Middle East & Africa
1.5 Market Dynamics
1.5.1 Market Opportunities
1.5.2 Market Risk
1.5.3 Market Driving Force
2 Manufacturers Profiles
2.1 Applied Materials
2.1.1 Applied Materials Details
2.1.2 Applied Materials Major Business and Total Revenue (Financial Highlights) Analysis
2.1.3 Applied Materials SWOT Analysis
2.1.4 Applied Materials Product and Services
2.1.5 Applied Materials Semiconductor Wafer Grinding Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.2 Logomatic
2.2.1 Logomatic Details
2.2.2 Logomatic Major Business and Total Revenue (Financial Highlights) Analysis
2.2.3 Logomatic SWOT Analysis
2.2.4 Logomatic Product and Services
2.2.5 Logomatic Semiconductor Wafer Grinding Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.3 Logitech
2.3.1 Logitech Details
2.3.2 Logitech Major Business and Total Revenue (Financial Highlights) Analysis
2.3.3 Logitech SWOT Analysis
2.3.4 Logitech Product and Services
2.3.5 Logitech Semiconductor Wafer Grinding Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.4 Ebara Corporation
2.4.1 Ebara Corporation Details
2.4.2 Ebara Corporation Major Business and Total Revenue (Financial Highlights) Analysis
2.4.3 Ebara Corporation SWOT Analysis
2.4.4 Ebara Corporation Product and Services
2.4.5 Ebara Corporation Semiconductor Wafer Grinding Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.5 Tokyo Seimitsu
2.5.1 Tokyo Seimitsu Details
2.5.2 Tokyo Seimitsu Major Business and Total Revenue (Financial Highlights) Analysis
2.5.3 Tokyo Seimitsu SWOT Analysis
2.5.4 Tokyo Seimitsu Product and Services
2.5.5 Tokyo Seimitsu Semiconductor Wafer Grinding Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.6 Lapmaster
2.6.1 Lapmaster Details
2.6.2 Lapmaster Major Business and Total Revenue (Financial Highlights) Analysis
2.6.3 Lapmaster SWOT Analysis
2.6.4 Lapmaster Product and Services
2.6.5 Lapmaster Semiconductor Wafer Grinding Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.7 Revasum
2.7.1 Revasum Details
2.7.2 Revasum Major Business and Total Revenue (Financial Highlights) Analysis
2.7.3 Revasum SWOT Analysis
2.7.4 Revasum Product and Services
2.7.5 Revasum Semiconductor Wafer Grinding Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
2.8 Entrepix
2.8.1 Entrepix Details
2.8.2 Entrepix Major Business and Total Revenue (Financial Highlights) Analysis
2.8.3 Entrepix SWOT Analysis
2.8.4 Entrepix Product and Services
2.8.5 Entrepix Semiconductor Wafer Grinding Equipment Sales, Price, Revenue, Gross Margin and Market Share (2018-2019)
3 Sales, Revenue and Market Share by Manufacturer
3.1 Global Semiconductor Wafer Grinding Equipment Sales and Market Share by Manufacturer (2018-2019)
3.2 Global Semiconductor Wafer Grinding Equipment Revenue and Market Share by Manufacturer (2018-2019)
3.3 Market Concentration Rate
3.3.1 Top 3 Semiconductor Wafer Grinding Equipment Manufacturer Market Share in 2019
3.3.2 Top 6 Semiconductor Wafer Grinding Equipment Manufacturer Market Share in 2019
3.4 Market Competition Trend
4 Global Market Analysis by Regions
4.1 Global Semiconductor Wafer Grinding Equipment Sales, Revenue and Market Share by Regions
4.1.1 Global Semiconductor Wafer Grinding Equipment Sales and Market Share by Regions (2015-2020)
4.1.2 Global Semiconductor Wafer Grinding Equipment Revenue and Market Share by Regions (2015-2020)
4.2 North America Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
4.3 Europe Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
4.4 Asia-Pacific Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
4.5 South America Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
4.6 Middle East and Africa Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
5 North America by Country
5.1 North America Semiconductor Wafer Grinding Equipment Sales, Revenue and Market Share by Country
5.1.1 North America Semiconductor Wafer Grinding Equipment Sales and Market Share by Country (2015-2020)
5.1.2 North America Semiconductor Wafer Grinding Equipment Revenue and Market Share by Country (2015-2020)
5.2 United States Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
5.3 Canada Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
5.4 Mexico Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
6 Europe by Country
6.1 Europe Semiconductor Wafer Grinding Equipment Sales, Revenue and Market Share by Country
6.1.1 Europe Semiconductor Wafer Grinding Equipment Sales and Market Share by Country (2015-2020)
6.1.2 Europe Semiconductor Wafer Grinding Equipment Revenue and Market Share by Country (2015-2020)
6.2 Germany Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
6.3 UK Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
6.4 France Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
6.5 Russia Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
6.6 Italy Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
7 Asia-Pacific by Regions
7.1 Asia-Pacific Semiconductor Wafer Grinding Equipment Sales, Revenue and Market Share by Regions
7.1.1 Asia-Pacific Semiconductor Wafer Grinding Equipment Sales and Market Share by Regions (2015-2020)
7.1.2 Asia-Pacific Semiconductor Wafer Grinding Equipment Revenue and Market Share by Regions (2015-2020)
7.2 China Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
7.3 Japan Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
7.4 Korea Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
7.5 India Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
7.6 Southeast Asia Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
7.7 Australia Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
8 South America by Country
8.1 South America Semiconductor Wafer Grinding Equipment Sales, Revenue and Market Share by Country
8.1.1 South America Semiconductor Wafer Grinding Equipment Sales and Market Share by Country (2015-2020)
8.1.2 South America Semiconductor Wafer Grinding Equipment Revenue and Market Share by Country (2015-2020)
8.2 Brazil Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
8.3 Argentina Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
9 Middle East & Africa by Countries
9.1 Middle East & Africa Semiconductor Wafer Grinding Equipment Sales, Revenue and Market Share by Country
9.1.1 Middle East & Africa Semiconductor Wafer Grinding Equipment Sales and Market Share by Country (2015-2020)
9.1.2 Middle East & Africa Semiconductor Wafer Grinding Equipment Revenue and Market Share by Country (2015-2020)
9.2 Saudi Arabia Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
9.3 Turkey Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
9.4 Egypt Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
9.5 South Africa Semiconductor Wafer Grinding Equipment Sales and Growth Rate (2015-2020)
10 Market Segment by Type
10.1 Global Semiconductor Wafer Grinding Equipment Sales and Market Share by Type (2015-2020)
10.2 Global Semiconductor Wafer Grinding Equipment Revenue and Market Share by Type (2015-2020)
10.3 Global Semiconductor Wafer Grinding Equipment Price by Type (2015-2020)
11 Global Semiconductor Wafer Grinding Equipment Market Segment by Application
11.1 Global Semiconductor Wafer Grinding Equipment Sales Market Share by Application (2015-2020)
11.2 Global Semiconductor Wafer Grinding Equipment Revenue Market Share by Application (2015-2020)
11.3 Global Semiconductor Wafer Grinding Equipment Price by Application (2015-2020)
12 Market Forecast
12.1 Global Semiconductor Wafer Grinding Equipment Sales, Revenue and Growth Rate (2021-2025)
12.2 Semiconductor Wafer Grinding Equipment Market Forecast by Regions (2021-2025)
12.2.1 North America Semiconductor Wafer Grinding Equipment Market Forecast (2021-2025)
12.2.2 Europe Semiconductor Wafer Grinding Equipment Market Forecast (2021-2025)
12.2.3 Asia-Pacific Semiconductor Wafer Grinding Equipment Market Forecast (2021-2025)
12.2.4 South America Semiconductor Wafer Grinding Equipment Market Forecast (2021-2025)
12.2.5 Middle East & Africa Semiconductor Wafer Grinding Equipment Market Forecast (2021-2025)
12.3 Semiconductor Wafer Grinding Equipment Market Forecast by Type (2021-2025)
12.3.1 Global Semiconductor Wafer Grinding Equipment Sales Forecast by Type (2021-2025)
12.3.2 Global Semiconductor Wafer Grinding Equipment Market Share Forecast by Type (2021-2025)
12.4 Semiconductor Wafer Grinding Equipment Market Forecast by Application (2021-2025)
12.4.1 Global Semiconductor Wafer Grinding Equipment Sales Forecast by Application (2021-2025)
12.4.2 Global Semiconductor Wafer Grinding Equipment Market Share Forecast by Application (2021-2025)
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 Distributors, Traders and Dealers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Data Source
15.3 Disclaimer
15.4 About US

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【掲載企業】

Applied Materials、Logomatic、Logitech、Ebara Corporation、Tokyo Seimitsu、Lapmaster、Revasum、Entrepix、

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★リサーチレポート[ 世界の半導体ウエハ研削装置市場2020年:企業別・地域別・種類別・用途別市場予測(~2025年)(Global Semiconductor Wafer Grinding Equipment Market 2020 by Manufacturers, Regions, Type and Application, Forecast to 2025)]についてメールでお問い合わせはこちらでお願いします。